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Embedded computer

Board-level GPU Platform

EBC 370
Product > Embedded computer > Board-level GPU Platform

EBC 370

The EBC370/EBC370X is a 3.5” single board computer (SBC) powered by 13th Gen Intel® Core™ processors. It features a SO-DIMM socket, supporting up to 32GB of DDR5 5200MHz memory with non-ECC support, along with integrated Intel® Iris® Xᵉ graphics.

Designed for performance and versatility, the EBC370/EBC370X includes an MXM slot, accommodating graphics accelerator cards or I/O expansion cards to meet diverse AI and visual needs.

With a wide operating temperature ranging from -20°C to 70°C, the EBC370X sustains in harsh environments, making it ideal for outdoor and semioutdoor embedded applications including kiosks, home automation, and thin clients.
• Intel® 13th Gen Intel® Core™ i7 processor, 15W, 28W
• 1 x DDR5 5200 SO-DIMM, non-ECC, up to 32GB 5200 MHz
• 1 x VGA, 1 x HDMI®, supports multiple displays
• TPM 2.0
• 24V DC IN
• 4 x 2.5 GbE LAN
• 3 x USB 3.2 Gen2, 3 x USB 2.0, 2 x RS-232, 2 x RS-232/485/422,
• 1 x SATA 3.0 , 16-bit GPIO (8 IN , 8 OUT)
• 1 x MXM slot (PCIe x4 LANS for MXM GPU card support)
• 1 x M.2 Key B , 1 x M.2 Key M

EBC370X: Industrial-Grade 3.5” SBC with 13th Gen Intel® Core™ and MXM GPU Expansion

The EBC370X is a high-performance 3.5” single board computer equipped with a 13th Gen Intel® Core™ processor. Designed for industrial applications, it supports powerful GPU acceleration via an MXM GPU expansion slot. Built for reliability in harsh environments, it operates within a temperature range of -20°C to 70°C, making it suitable for a wide range of embedded applications including kiosks, unmanned systems, home automation, lightweight edge servers, robotics, and machine vision.



Compact Yet Powerful with 13th Gen Intel® Core™

The EBC370X features a 13th Gen Intel® Core™ mobile processor, with the base model supporting up to 14 cores and a 28W TDP, such as the Intel® i7-1370PRE. It delivers the performance needed for compute-intensive applications like deep learning inference, AI control, and vision processing.

It supports the latest DDR5-5200 SO-DIMM memory, expandable up to 32GB—ideal for systems that demand high-speed processing and large data handling capabilities.



MXM Slot for GPU Expansion

The board includes an MXM slot, allowing integration of discrete GPUs such as the NVIDIA RTX A1000 or A4500. This enables the system to go beyond CPU-based processing and handle GPU-parallelized AI models and high-speed image processing. It is particularly effective for autonomous mobile robots (AMRs) requiring local inference, visual recognition, and autonomous navigation.



Versatile Expansion Slots and I/O Ports

For storage, the board provides a SATA 3.0 port and an M.2 Key-M (2280) slot supporting NVMe or SATA SSDs. Additionally, the M.2 Key-B (3042/3052) slot supports LTE/5G modules, and an onboard Nano-SIM slot is included—ideal for AMRs requiring wireless connectivity.

The board is equipped with a rich set of I/O ports for seamless integration with sensors and peripheral devices:

Rear Panel:

• 3 x USB 3.2 Gen2

• 1 x USB 2.0

• 4 x Gigabit Ethernet (GbE)

• 1 x VGA / 1 x HDMI port

Internal Connectors:

• 2 x USB 2.0 (via pin headers)

4 x Serial Ports (2 x RS232, 2 x RS232/485/422)

• 8-bit GPIO (4 In / 4 Out)



Designed for Harsh Industrial Environments

The EBC370X is engineered to operate reliably in extreme industrial conditions with a supported operating temperature range of -20°C to 70°C. It is certified for CE and FCC Class A, ensuring its reliability and stability as an industrial-grade board.

It supports 24V DC input and is compatible with both AT and ATX power modes, offering flexibility across different system architectures.



Standard Package and Optional Accessories

The standard EBC370X package includes the mainboard and two COM port cables. Optional accessories include:

Power Adapter (FSP120-AAAN3, 60W)

• DC Power Cable (Terminal Block Type)

• Heat Spreader

• Dedicated Cooling Fan


※ Note: The heat spreader thermally bridges the CPU and other heat-generating components to the system’s cooling solution.

For high-performance operations, a dedicated heatsink and cooling design may be required.



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